Thermoplastic Adhesives - the Attachment Solution for Multichip Modules
نویسندگان
چکیده
Electronic Polymers are solving new problems in the technology revolution brought on by the quest for ultimate computing performance. Computing power will increase by an order of magnitude during this decade and MultiChip Modules (MCM) will be the main enabling technology. The MCM strategy of closely packing bare die onto inorganic or polymer substrates demands new materials, especially for die attachment. The traditional silver-epoxies, silver-glass and metal alloy die attach products do not meet many of these new requirements. More compliancy and elasticity is required to mechanically decouple die from organic substrates used in MCM-L and MCM-D constructions. These same material characteristics are also needed to safely attach large die to MCM-C modules. Simple removability, while maintaining high reliability, is needed for acceptable module yield as well as many of the Known Good Die (KGD) strategies. Thermoplastics fulfill these requirements.
منابع مشابه
Optimal Design of Self-Damped Lossy Transmission Lines for Multichip Modules
abstract This paper presents a simple and robust method of designing the lossy-transmission-line interconnects in a network for multichip modules. This method uses wire-sizing entirely to meet the electrical damping criteria to solve the problems encountered in propagating high-speed signals through unterminated lossy transmission lines on the substrates of multichip modules (MCM). The optimal ...
متن کاملMCM-L Technology: A Systems Cost Analysis for a High Volume Automotive Electronics Application
Cost concerns related to the development and manufacturability of multichip modules have limited the widespread use of MCM’s for high-volume, low-cost applications. This paper discusses the many elements necessary to evaluate fully the financial effects of MCM programs. In particular, this paper evaluates a development program for a multichip module design targeted for a high volume automotive ...
متن کاملColor stability, water sorption and cytotoxicity of thermoplastic acrylic resin for non metal clasp denture
PURPOSE The aim of this study was to compare the color stability, water sorption and cytotoxicity of thermoplastic acrylic resin for the non-metal clasp dentures to those of thermoplastic polyamide and conventional heat-polymerized denture base resins. MATERIALS AND METHODS Three types of denture base resin, which are conventional heat-polymerized acrylic resin (Paladent 20), thermoplastic po...
متن کاملEnergy Considerations in Multichip-Module Based Multiprocessors
Multichip modules permit highly eecient implementation of \tiled" architectures. If the tiles are implemented in submicron CMOS, extremely high computation rates can be achieved, but power dissipation becomes the principal factor limiting achievable levels of integration and performance. This paper describes some examples of tiled architectures, and discusses the feasibility and advantages of r...
متن کامل